Research

Heat & Charge Transfer

The transport of thermal and electrical energy. Engineering colloidal materials and connected pathways to control phonon and charge transport.

Heat paths

Chains of particles spanning the gap between a chip and its heat sink, each chain carrying heat upward

Heat paths are connected routes that facilitate thermal transport through a material. Directing the assembly of thermally conductive fillers can promote phonon transport and reduce thermal resistance, enabling efficient heat dissipation in thermal interface materials.

Aligned fillers

Directing thermally conductive particles into aligned networks to create connected pathways for heat transport.

Directional heat transport

Tailoring filler orientation and connectivity to enhance thermal conduction along selected directions.

Thermal interface materials

Engineering thermally conductive composites to reduce thermal resistance between heat-generating devices and heat sinks.

Key toolbox elements

Calculation / modeling AI / deep learning Multiphysics simulations Electro-magnetics Interparticle interactions Directed assembly Advanced packaging Surface engineering

Related work

“Field-directed thermal interface material … ”
In preparation — paper and patent
“MXene assembly … ”
In preparation — paper and patent
“Electric and Magnetic Field-Driven Dynamic Structuring for Smart Functional Devices”
Micromachines (2023), 14, 661

Charge paths

Particles packed between two boards form conductive columns, each carrying current across the joint

Charge paths are connected routes that facilitate charge transport through a material. Directing the assembly of conductive particles can create efficient, tailored pathways for electron transport, supporting applications ranging from anisotropic conductive films to energy storage devices such as supercapacitors.

Conductive networks

Organizing conductive particles into connected networks to facilitate electron transport and reduce electrical resistance.

Anisotropic conductive films

Tailoring particle arrangements to enable electrical connections through the film while maintaining insulation between adjacent contacts.

Energy storage electrodes

Engineering electrode structures to support electron transport and ion access for efficient charge storage in devices such as supercapacitors.

Key toolbox elements

Calculation / modeling AI / deep learning Multiphysics simulations Electro-magnetics Interparticle interactions Directed assembly Advanced packaging Surface engineering

Related work

“System with Field-Assisted Conductive Adhesive Bonds”
US Patent (2018), US 9,942,986 B1 — Assignee: Apple Inc.
“Directed Dielectrophoretic Assembly and Separation on Microelectrodes Patterned via Stereolithography 3D Printed Shadow Masks”
Lab on a Chip (2026), 26, 2486
“Method for Manufacturing Dielectrophoretic Electrode, Dielectrophoretic Electrode, Method for Separating and Assembling Particles using the Same, and Self-Healing Method of Dielectrophoretic Electrode Path using the Same”
KR Patent Application (2026), No. 10-2026-0080136
“3D-Printed Shadow Masks for Micro-Patterned Electrodes”
RSC Advances (2024), 14, 34586
“Thermoplastic Polymer-Based 3D-Printed Shadow Masks for Electrode Patterning”
KR Patent Application (2025), No. 10-2025-0045665
“Dynamic Interface Engineering via Mechanistic Understanding of Copper Reconstruction in Electrochemical CO2 Reduction Reaction”
Journal of the American Chemical Society (2026), 148, 6045
“Supercolloidal Spinners: Complex Active Particles for Electrically Powered and Switchable Rotation”
Advanced Functional Materials (2018), 28, 1803465

See the full publication list →